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| MP03 XX 440 Series MP03 XX 440 Series Dual Diode Modules Replaces December 1998 version, DS5106-2.0 DS5106-3.0 January 2000 FEATURES s Dual Device Module s Electrically Isolated Package s Pressure Contact Construction s International Standard Footprint s Alumina (non-toxic) Isolation Medium Code HB KEY PARAMETERS 2100V VRRM 11250A IFSM IF(AV)(per arm) 440A 2500V Visol CIRCUIT OPTIONS Circuit APPLICATIONS s Rectifier Bridges s DC Power Supplies s Plating Rectifiers s Traction Systems VOLTAGE RATINGS Type Number Repetitive Peak Voltages VRRM 2100 2000 1800 1600 Conditions G GN PACKAGE OUTLINE MP03/440 - 21 MP03/440 - 20 MP03/440 - 18 MP03/440 - 16 Tvj = 150oC IRM = 30mA VRSM = VRRM + 100V respectively Module outline type code: MP03. See Package Details for further information. Lower voltage grades available. For full description of part number see "Ordering Instructions" on page 3. CURRENT RATINGS - PER ARM Symbol Parameter Conditions Tcase = 75oC Tcase = 85oC IF(AV) Mean forward current Halfwave, resistive load Theatsink = 75oC Theatsink = 85oC IF(RMS) RMS value Tcase = 75oC Max. 440 390 340 300 690 Units A A A A A 1/10 MP03 XX 440 Series SURGE RATINGS - PER ARM Symbol IFSM Parameter Surge (non-repetitive) on-state current Conditions 10ms half sine; Tj = 150oC 10ms half sine; Tj = 150oC VR = 0 VR = 50% VRRM VR = 0 VR = 50% VRRM Max. 11250 9000 630000 405000 Units A A A2s A2s It 2 I t for fusing 2 THERMAL & MECHANICAL RATINGS Symbol Parameter dc Rth(j-c) Thermal resistance - junction to case per Diode Thermal resistance - case to heatsink per Diode Virtual junction temperature Storage temperature range Isolation voltage Commoned terminals to base plate AC RMS, 1min, 50Hz halfwave 3 phase Rth(c-hs) Tvj Tsto Visol Mounting torque = 5Nm with mounting compound Conditions Max. 0.12 0.13 0.14 0.05 150 -40 to 150 2.5 Units o C/W o C/W C/W C/W o o o C C o kV CHARACTERISTICS Symbol VFM IRM VTO rT Parameter Forward voltage Peak reverse current Threshold voltage On-state slope resistance Conditions At 1000A , Tcase = 25oC At VRRM, Tj = 150oC At Tvj = 150oC At Tvj = 150oC Max. 1.29 30 0.94 0.32 Units V mA V m 2/10 MP03 XX 440 Series ORDERING INSTRUCTIONS Part number is made up as follows: MP03 HB 440 - 18 MP 03 HB 440 18 = Pressure contact module = Outline type = Circuit configuration code (see "circuit options" - front page) = Nominal average current rating at Tcase = 75oC = VRRM/100 Examples: MP03HB440 - 21 MP03G440 - 16 MP03GN440 - 18 Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when requested. MOUNTING RECOMMENDATIONS Adequate heatsinking is required to maintain the base temperature at 75oC if full rated current is to be achieved. Power dissipation may be calculated by use of VTOand rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required. The heatsink surface must be smooth and flat; a surface finish of N6 (32in) and a flatness within 0.05mm (0.002") are recommended. Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. care should be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. After application of thermal compound, place the module squarely over the mounting holes, (or 'T' slots) in the heatsink. Using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 5Nm (44lb.ins) is reached at both ends. It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module. 3/10 MP03 XX 440 Series Curves 2500 Measured under pulse conditions 2000 Instantaneous forward current IF - (A) 1500 1000 500 Tj = 150C 0 0.5 1.0 1.5 2.0 Instantaneous forward voltage VF - (V) 2.5 Fig. 1 Maximum (limit) forward characteristics (Per diode) 0.15 Thermal impedance - (C/W) d.c. 0.10 0.05 0 0.001 0.01 0.1 Time - (s) 1.0 10 100 Fig. 2 Transient thermal impedance (DC) - (Per diode) 4/10 MP03 XX 440 Series 30 Peak half sine wave forward current - (kA) 25 420 400 380 360 I2t value - A2s x 103 20 15 10 340 5 I2t 0 320 300 20 30 50 1 ms 10 1 23 5 10 cycles at 50Hz Duration Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150C) 5/10 MP03 XX 440 Series 800 700 600 500 400 300 200 100 0 60 Rectangular 180 Rectangular 180 Sine 120 Rectangular d.c. On-state power loss per device - (W) 0 100 200 300 400 Mean forward current - (A) 500 600 700 Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz 160 Maximum permissible case temperature - (C) 140 120 100 80 60 40 20 0 60 Rectangular 120 Rectangular 180 Sine 180 Rectangular 0 100 200 300 400 Mean forward current - (A) 500 d.c. 600 700 Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz 6/10 MP03 XX 440 Series 2000 0.02 1800 1600 1400 Total power - (W) 0.01 Rth(hs-a) C/W R - Load 0.04 L - Load 1200 1000 800 600 400 200 0 60 40 80 100 120 140 0 Maximum ambient temperature - (C) 0.08 0.10 0.12 0.15 0.20 0.30 0.40 0 20 200 400 600 D.C. output current - (A) 800 Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal). 7/10 MP03 XX 440 Series 2400 0.02 2200 2000 1800 0.04 1600 Total power - (W) 0.01 Rth(hs-a) C/W R & L - Load 1400 1200 0.08 1000 0.12 800 600 400 200 0 60 40 80 100 120 140 0 Maximum ambient temperature - (C) 0.10 0.15 0.20 0.30 0.40 0 20 250 500 750 D.C. output current - (A) 1000 Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal). 8/10 MP03 XX 440 Series PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 42.5 4 holes O5.5 35 28.5 5 50 38 18 80 2x M8 2 3 1 52 32 92 Recommended fixings for mounting: Recommended mounting torque: Recommended torque for electrical connections: Maximum torque for electrical connections: Nominal weight: 950g Module outline type code: MP03 M5 socket head cap screws. 5Nm (44lb.ins) 8Nm (70lb.ins) 9Nm (80lb.ins) CIRCUIT CONFIGURATIONS 1 2 HB 3 1 G 2 3 1 2 GN 3 9/10 MP03 XX 440 Series http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS5106-3 Issue No. 3.0 January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 10/10 |
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